Dome switch stack and method for making the same

ABSTRACT

Systems and methods for providing input component assemblies for dome switches are provided. In some embodiments, an input component assembly may include a first conductive contact pad coupled to a first board of a switch, a second conductive contact pad coupled to a second board of the switch, and a layer of conductive adhesive between the first conductive pad and the second conductive pad, where the layer is operative to provide a seal for the switch.

FIELD OF THE INVENTION

This can relate to systems and methods for providing input componentassemblies in electronic devices and, more particularly, to systems andmethods for providing input component assemblies with dome switches inelectronic devices.

BACKGROUND

Dome switches may be used in various electronic devices (e.g., portablemedia players and cellular telephones). A dome switch generally has adome with a conductive inner surface operative to close a circuit whenthe dome is deformed and/or pressed. Upon depression of the dome ordeformation of the dome, the conductive inner surface is brought incontact with a conductive pad positioned under the dome. The conductivepad may be provided on a circuit board of an electronic device, and whenthe conductive inner surface is brought in contact with the conductivepad to form a connection, the circuit of the switch can provideelectrical signals to other components of the electronic device.

Electronic devices with dome switches invariably come in to contact withliquids, oils, and other elements that can corrode the switch. Domeswitches may become corroded when liquids and oils seep in to crevicesaround switch during use and/or when exposed to oils and/or liquidsduring assembly of the dome switch. If the switch becomes corroded, thenforming a connection is made more difficult, if not, impossible. Thus,there is a need to provide a dome switch resistant to liquid and othercorrosive elements.

SUMMARY

Systems and methods for providing input component assemblies for domeswitches are provided. In some embodiments, an input component assemblymay include a first conductive contact pad coupled to a first board of aswitch, a second conductive contact pad coupled to a second board of theswitch, and a layer of conductive adhesive between the first conductivepad and the second conductive pad, where the layer is operative toprovide a seal for the switch.

BRIEF DESCRIPTION OF THE DRAWINGS

The above and other aspects and advantages of the invention will becomemore apparent upon consideration of the following detailed description,taken in conjunction with accompanying drawings, in which like referencecharacters refer to like parts throughout, and in which:

FIG. 1A is a perspective view of an exemplary electronic device inaccordance with some embodiments of the invention;

FIG. 1B is a top perspective view of a portion of the electronic deviceof FIG. 1A, taken from line IB-IB of FIG. 1A, in accordance with someembodiments of the invention;

FIG. 2A is a cross sectional view of switch assembly 110 with sonic weldjoints (denoted as 210) taken across line II-II of FIG. 1A in accordancewith some embodiments of the invention;

FIG. 2B is a cross sectional view of switch assembly 110 with sonic weldjoints (denoted as 210) taken across line II-II of FIG. 1A in accordancewith some embodiments of the invention;

FIG. 3A is a cross sectional view of an alternative embodiment of switchassembly 110, similar to FIG. 2A, with sonic weld joints (denoted as205) taken across line II-II of FIG. 1A in accordance with someembodiments of the invention;

FIG. 3B is a cross sectional view of switch assembly 110, similar toFIG. 2B, with sonic weld joints (denoted as 205) taken across line II-IIof FIG. 1A in accordance with some embodiments of the invention;

FIG. 4 is a bottom perspective view of elements of switch assembly 110with sonic weld joints (denoted as 210) in accordance with someembodiments of the invention;

FIG. 5 is a bottom perspective view of switch assembly with sonic weldjoints (denoted as 210) in accordance with some embodiments of theinvention;

FIG. 6 is a bottom cross sectional view of switch assembly 110 withsonic weld joints (denoted as 210) taken across line VI-VI of FIG. 1A inaccordance with some embodiments of the invention;

FIG. 7 is a flowchart illustrating a method in accordance with someembodiments of the invention;

FIG. 8 is a cross sectional view of switch assembly 110 using conductivecovering (denoted as 310) taken across line II-II of FIG. 1A inaccordance with some embodiments of the invention;

FIG. 9 is a cross sectional view of switch assembly 110 using conductivecovering (denoted as 310) taken across line II-II of FIG. 1A inaccordance with some embodiments of the invention;

FIG. 10 is a cross sectional view of switch assembly 110 usingconductive covering (denoted as 310) taken across line VI-VI of FIG. 1Ain accordance with some embodiments of the invention;

FIG. 11 is a cross sectional view of switch assembly 110 usingconductive covering (denoted as 310) taken across line VI-VI of FIG. 1Ain accordance with some embodiments of the invention;

FIG. 12 is a bottom perspective view of switch assembly with conductivecovering (denoted as 310) in accordance with some embodiments of theinvention;

FIG. 13 is a flowchart illustrating a method in accordance with someembodiments of the invention;

FIG. 14 is a cross sectional view of switch assembly using conductiveadhesive (denoted as 410) taken across line II-II of FIG. 1A inaccordance with some embodiments of the invention;

FIG. 15 is a cross sectional view of switch assembly using conductiveadhesive (denoted as 410) taken across line II-II of FIG. 1A inaccordance with some embodiments of the invention;

FIG. 16 is a bottom perspective view of an assembly process for a switchassembly using conductive adhesive;

FIG. 17 is a cross sectional view of switch assembly using conductiveadhesive (denoted as 510) taken across line II-II of FIG. 1A inaccordance with some embodiments of the invention;

FIG. 18 is a cross sectional view of switch assembly using conductiveadhesive (denoted as 510) taken across line II-II of FIG. 1A inaccordance with some embodiments of the invention;

FIG. 19 is a bottom perspective view of an assembly process for a switchassembly using conductive adhesive;

FIG. 20 is a bottom perspective view of switch assembly with conductiveadhesive (denoted as 410) in accordance with some embodiments of theinvention;

FIG. 21 is a bottom perspective view of switch assembly with conductiveadhesive (denoted as 410) in accordance with some embodiments of theinvention; and

FIG. 22 is a flowchart illustrating a method in accordance with someembodiments of the invention.

DETAILED DESCRIPTION OF THE DISCLOSURE

An input component assembly that is resistant to liquids, oils, andcorrosive elements (e.g., gases) and methods for making the same aredisclosed. Conductive adhesive, sonic weld joints, and/or conductiveenclosures for input component elements (e.g., switch elements) mayserve to protect input component elements from liquids, oils, and/orother corrosive elements in embodiments of the invention. In one or moreembodiments, a water resistant and/or hermetic seal may be formed aroundswitch elements to serve as protection for the switch.

FIG. 1A is a perspective view of an exemplary electronic device inaccordance with some embodiments of the invention. Electronic device 100can be any suitable device capable of receiving inputs through one ormore input component assemblies, such as switch assembly 110. The termelectronic device can include, but is not limited to, media players,video players, still image players, game players, music recorders, voicerecorders, cameras, radios, medical equipment, domestic appliances,vehicle instruments, musical instruments, calculators, cellphones,wireless communication devices, personal digital assistants,programmable remotes, pagers, laptops, computers, printers, and/or anycombination thereof. Electronic device 100 may have a single function ormultiple functions.

In one or more embodiments, electronic device 100 may be any portable,mobile, hand-held, or miniature mobile electronic device. Miniaturedevices may have a form factor that is smaller than a hand held device,such as an iPod™ Shuffle available by Apple Inc. of Cupertino, Calif.Illustrative miniature devices may be incorporated into various objectsthat include, but are not limited to, the following: watches, rings,necklaces, belts, headsets, shoe accessories, virtual reality devices,other wearable electronics, sports or fitness equipment accessories, keychains, or any combination thereof. Alternatively, electronic device 100may not be portable at all.

As shown in FIG. 1A, electronic device 100 can be hexahedral. Although,it should be noted that housing 101 is only exemplary and need not besubstantially hexahedral. Housing 101 can be formed in any other shape,including, but not limited to, the following: spherical, ellipsoidal,conodial, octahedral, or any combination thereof, for example.

Electronic device 100 can include one or more additional components,some of which may be configured to be controlled by one or more inputcomponent assemblies of device 100. For example, electronic device 100may include a switch assembly 110 that can allow a user to manipulate atleast one function of electronic device 100, one or more outputcomponent 104 assemblies that can provide the user with device generatedinformation, and at least one protective housing 101 that can at leastpartially enclose a particular input component of switch assembly 110,and output component 104. Switch assembly 110 may be a dome switchassembly or any other type of switch assembly having an actuator thatmay be depressed or deformed to close an otherwise open circuit ofdevice 100, or to open an otherwise closed circuit. Switch assembly 110may be made from any suitable material, including, but not limited to,metal, plastic, glass, or any combination thereof.

As shown in FIG. 1A, switch assembly 110 may include a button 106 thatmay be positioned within or at least partially exposed through anopening 105 of housing 101. Button 106 is circular and fits withincircular opening 105. Although depicted as circular, those with skill inthe art will recognize that both button 106 and opening 105 can have avariety of shapes, such as square, rectangular, or any other shape. Atop surface 107 of button 106 can have an icon 108 to indicate thelocation of button 106 and/or to represent functionality provided bybutton 106. For example, button 106 may be made from the same materialand have the same color as housing 101 and icon 108 may allow a user tolocate button 106 on device 100 and differentiate button 106 fromhousing 101.

Icon 108 can be any type of symbol, letter, numeral, text, shape, and/orany other representation or combination thereof. Icon 108 may be arepresentation of a functionality offered by device 100 and thefunctionality can be provided (e.g., instructions can be executed toprovide functionality) when the user interacts with button 106. Button106 may be positioned within device 100 to ensure that icon 108 isproperly aligned relative to the other components of device 100. Forexample, as shown in FIG. 1, when icon 108 is properly aligned, each ofthe four sides for icon 108 may appear to run parallel to correspondingsides of device 100, and the curved edges of icon 108 may appear to bealigned with curved edges of device 100. In another example, icon 108may be text and proper alignment of button 106 within device 100 maygive the appearance that the text of icon 108 is written on an imaginaryline running parallel to a bottom side 103 of device 100.

Continuing with FIG. 1A, a force or pressure may be exerted by a user oran object in the direction of arrow A on top surface 107 of button 106(e.g., in a direction perpendicular to a surface of housing 101 aboutbutton 106), and in some embodiments, this pressure exertion may depressor deform an actuator of a switch that may be positioned below button106 within housing 101 to actuate the switch. The switch may bepositioned under the physical input element of switch assembly 110(e.g., button 106) such that, when button 106 is depressed due to theuser input force in the direction of arrow A, the switch may close anelectrical circuit. By way of example, a switch can include a dome thatmay be positioned over a contact pad such that, when the dome isdeformed with the application of force in the direction of arrow A viabutton 106, the dome may come into physical contact with the contact padand may close a circuit. The dome may provide a tactile resistance thatthe user must overcome to at least partially invert the dome. In otherembodiments, a dome may not be used underneath the button. For example,button 106 may be positioned over a flexible circuit board that may becompressed and brought in to contact with a contact pad below tocomplete the circuit.

A switch may be actuated when a change of state is detected and/ormeasured either in addition to or instead of being actuated with directcontact as described above. A capacitor may be defined between switchelements and/or switch elements and a finger of a user. A sensingmechanism may be placed below the button 106 to detect the change instate (e.g., change in capacitance). For example, a capacitor may bedefined between a dome and a terminal in a circuit board, betweenopposing terminals, between a finger and a terminal, between a terminaland a contact area, and/or between any other elements of a switch.Detection circuitry or a controller coupled to the switch can measure achange in capacitance between the conductors due to the change indistance between the conductors, and can interpret the change incapacitance as a user presses the button 106 of the dome switch. Afterinterpreting the change in state (e.g., capacitance), the controller cancause a circuit to close. In some embodiments, capacitive sensingcircuitry or a controller can be coupled with or incorporated in switchto detect an input when a user applies a force to the dome.

Button 106 may be depressed, touched, and/or a user or an object may bemoved into close proximity to the button 106 (e.g., a finger or a stylusmoved close to the button) allowing for detection of a change in aparticular state (e.g., change in capacitance, change in electricalcurrent, change in light sensed, sound waves, etc.), and the change instate (e.g., increase in capacitance, light sensed, etc.) may bedetected and trigger completing a circuit. By way of example, a user'sfinger placed over the button 106 may serve as a conductor of acapacitor that may trigger completing a circuit. In another example,movement of a contact area toward an opposing terminal (e.g., a terminalpositioned on a circuit boards beneath a conductive pad) closer togethermay cause a change in capacitance that can be detected and triggerclosing a circuit. Reducing the distance between the contact area and anopposing terminal may cause a change in capacitance that can be detectedand trigger opening a circuit.

FIG. 1B is a top perspective view of a portion of the electronic deviceof FIG. 1A, taken from line IB-IB of FIG. 1A, in accordance with someembodiments of the invention. Button 106 of switch assembly 110 may sitwithin opening 105 in housing 101 of device 100. Icon 108 may be alignedwithin opening 105 such that the bottom of icon 108 may run parallel tobottom side 103 of device 100.

A user can activate switch of switch assembly 110 by exerting force ontop surface 107 of button 106 in the direction of A. For example, forceapplied to top surface 107 may depress or deform actuator of switchassembly 110 from an original, undepressed position to an actuated,depressed position to change a functional state of device 100, such asto turn device 100 off or on. Continuing with the example, actuator maybe dome shaped, conical shaped, and/or have any other shape that can bedeformed to move contact areas closer together and return to an originalposition. When a user terminates the force applied at top surface 107,actuator of switch assembly 110 may return to its original position.

In another example, a user may touch and/or come into close proximity totop surface 107 of button 106 of switch assembly 110, and a change ofstate that is being monitored (e.g., capacitance) may be detected. Inparticular, a finger placed on the button 106 and a terminal in acircuit board may define a capacitor, and a change in capacitance may bedetected when a user touches button 106 at top surface 107 such thatmovement of the dome may not be relevant to detecting actuation. In someembodiments, a terminal opposing a contact area that is positionedbeneath button 106 may define a capacitor, and a change in capacitancemay be detected when a user moves the terminal and the contact areacloser together to change the distance between conductors resulting in achange in capacitance.

A terminal can be electrically connected to any suitable electronicdevice component to provide a signal indicating that a user has providedan input to switch (e.g., that the user has caused dome to deflect). Insome embodiments, terminal can be electrically connected to a controlleroperative to detect a change in electrical attributes associated withterminal when button 106 is depressed. The controller can detect and/ormeasure any suitable electrical attribute of the terminal including, forexample, changes in value of voltage, current, resistance, power,capacitance, impedance, or combinations of these. The particularelectrical attribute detected can include direct contact of componentswith contact area above terminal (e.g., direct contact to changeresistance), or indirect interactions with the terminal (e.g., changingthe distance between conductors to change capacitance). Afterinterpreting the change, the controller can complete the circuit or openthe circuit.

Invariably, with use, device 100 may come into contact with corrosiveelements that can harm device 100 (e.g., corrosive elements may seep inthrough hole 105), and if left undeterred, corrosive elements mayingress through actuator (e.g., dome sheet of a dome switch) tocontaminate switch of switch assembly 110. Various embodiments forswitch assembly 110 will be described with FIGS. 2A-22 that reducessusceptibility to corrosion of the switch assembly 110.

FIG. 2A is a cross sectional view of switch assembly 110 with sonic weldjoints (denoted as 210) taken across line II-II of FIG. 1A in accordancewith some embodiments of the invention. Switch assembly 210 may have aweld plate 202 coupled to an underside surface 207 of button 106 at oneor more sonic weld joints (e.g., as depicted with 206 and 208) to form aseal around switch assembly 210 elements. At each weld joint 206 and208, a portion of a top surface (e.g., as depicted with 207) of weldplate 202 and a portion of underside surface (e.g., as depicted with213) of button 106 may be welded together at sonic weld joints 206 and208. Welding at sonic weld joints 206 and 208 may cause the materials tomelt at the welding area and form a hermetic seal and/or liquidresistant seal around switch assembly 210 elements and may protectswitch assembly 210 elements from corrosive elements. For example, weldplate 202 and button 106 may secure a lip of actuator (e.g., as depictedwith 214) in place, and actuator 200 and button 106 may partiallyenclose or completely enclose switch elements of switch assembly 210 toensure that corrosive elements are not able to ingress actuator 200.

Weld plate 202 and portions of button 106 at sonic weld joints 206 and208 may be created out of plastic, metal, any other material, orcombination of materials that allows for sonic welding. Although FIG. 2Aillustrates a particular joint design, those with skill in the art willrecognize that any other sonic weld joint design or configuration can beused for mating surfaces (e.g., bottom surface 213 of button 106 and topsurface 207 of weld plate 202) for sonic welding. Joint designs mayinclude, but are not limited to, the following: shear joint, step joint,tongue and groove, and/or any other type of joint design.

Sonic weld joints may be disposed around switch assembly 210 elementsand/or actuator 200 to create a seal for the switch. Actuator 200 mayhave a three dimensional shape that at least partially encloses switchassembly 210 elements. For example, actuator 200 may be a dome-shapedactuator 200 to enclose a circuit board and/or contact areas and may besecured to fit against the underside surface of button 106 to encloseswitch elements. Actuator 200 may be formed from metal, plastic,flexible material that allows actuator 200 to deform, and/or any othermaterial or combination thereof.

When force is exerted on actuator 200, actuator 200 may deform allowingfirst contact area 220 and second contact area 224 of switch assembly210 to move closer together. Further deformation of actuator 200, insome embodiments, may allow opposing electrical contact areas (e.g.,first contact areas 220 and second contact areas 224) within switchassembly 210 to come into physical contact and electrically connect toclose a circuit. In addition to or instead of closing a circuit withphysical contact between opposing contact areas, force exerted onactuator 200 may allow second contact area 224 and terminal 221 to movecloser together to cause a change in state, such as an increase incapacitance, and detection of the change in state may trigger closing acircuit.

A capacitor may be defined between contact area 224 and terminal 221(e.g., beneath contact area 220). For example, terminal 221 may bepositioned on the surface of circuit board 222 or within a stack oflayer that create circuit board 222 and contact area 224 may bepositioned opposite terminal 221. In some embodiments, terminal 221 canbe electrically connected to controller 223 operative to detect and/ormeasure a change in electrical attributes associated with terminal 221when button 106 is depressed and/or released, and the detection of whichmay trigger closing or opening a circuit in response to the detectedand/or measured change.

At rest in an original state, electrical contact areas 220 and 224 ofswitch assembly 210 are separated and the switch is said to beelectrically “open.” In some embodiments, when actuator 200 iscompressed against support surface 203 to a point where actuator 200deforms, opposing electrical contact areas 220 and 224 of the switch maybe moved to be in physical and electrical contact to complete anelectrical circuit between opposing contact areas 220 and 224, and aresaid to electrically “close” the switch. The switch may also or insteadbe triggered by movement of second contact area 224 and terminal 221(e.g., beneath first contact area 220) closer together to change a state(e.g., capacitance) and detection of the change by the controller 223may cause the controller 223 to close the circuit. And, when secondcontact area 224 and terminal 221 (e.g., beneath first contact area 220)move further apart, the controller 223 detects that change incapacitance as well and opens the circuit.

Actuator 200 may compress when contact force is exerted on actuator 200from above at top surface 107 of button 106 for switch assembly 210.Force may be applied to button 106 by a user from above in a directionof arrow A causing actuator 200 to deform. For example, a user may applyforce on actuator 200 by depressing button 106 within housing 101, andactuator 200 may deform when the force against button 106 causesactuator 200 to come into contact with support surface 203 and deform.FIG. 2B below provides more detail on a deformed actuator 200 that maycreate an electrical connection between contact areas 220 and 224.

A portion of actuator 200 may fit within gap 212 or a cavity providedbetween weld plate 202 and button 106. In some embodiments, actuator 200may have interference element 216 that fits within gap 212, and actuator200 may move towards or away from interference element 216 when a userinteracts with button 106. The portion of actuator 200 that fits withinthe gap may be a lip 214 and/or an edge of actuator 200 that can fitwithin gap 212 and is positioned above interference element 216.Interference element 216 provides interference when actuator 200 deformsor moves within gap 212, and interference element 216 may act as anadditional seal for switch assembly 210.

In one or more embodiments, as shown in FIG. 2A, interference element216 may be an O-ring. O-ring or toric joint may be a mechanical gasketthat is shaped like a torus with a disc-like cross-section. Interferenceelement 216 may be sized and have a particular shape to provide asubstantially guaranteed interference fit for actuator 200.

One or more electrical contact areas (e.g., 220 and 224), such as coppercoated conductive pads, may be coupled to a circuit board (e.g., circuitboard 222) that fits underneath button 106. Circuit board, as usedherein, may refer to a flexible or a rigid printed circuit board.Circuit boards can have conductive silicon glued to the board and/orhave silicon with traces. Circuit boards (e.g., circuit board 222) canextend away from switch assembly 210 and can support and interconnectwith any desired amounts of circuitry (e.g., controller 223) for device100. For example, circuit board 222 may fit on inner surface 217 ofactuator 200 and have electrical contact area 220, such as one or moreconductive pads that are coupled to the circuit board. In someembodiments, contact area 224 may electrically connect when put incontact with another opposing electrical contact area (e.g., contactarea 220) and/or detection of a change in state between contact area 224and terminal 221 (e.g., beneath contact area 220) may trigger theswitch. In an embodiment, conductive contact pads of contact area 220are copper coated conductive pads positioned over terminal 221, andcontact area 224 is a conductive material applied to underside surfaceof button 106.

FIG. 2B is a cross sectional view of switch assembly 210 with sonic weldjoints taken across line II-II of FIG. 1A in accordance with someembodiments of the invention. FIG. 2B illustrates an actuator 200 ofswitch assembly 210 in an actuated state. When actuator 200 is in theactuated state, actuator 200 is deformed causing contact areas 220 and224 to move closer together. Movement of contact area 224 and terminal221 (e.g., beneath contact area 220) closer together may cause a changein state (e.g., increase capacitance) and the detected change in stateby the controller 223 may cause the controller 223 to close the switchin some embodiments. Force applied to top surface 107 of button 106 inthe direction of arrow A may cause actuator 200 to decompress. Enoughforce may be applied to top surface 107 of button 106, and, in turn,causing actuator 200 to contact support surface 203 resulting indeformation of actuator 200 thereby allowing contact areas 220 and 224to be put in sufficient physical contact and the switch may close.

In an embodiment, pressure may be applied to top surface 107 of button106 and actuator 200 may move toward support surface 203 thereby causinglip 214 to compress against interference element 216. Interferenceelement 216 may be designed to handle the application of pressure. Forexample, interference element 216 may deform and/or absorb some of thepressure when force is applied. Interference element 216 may return tothe original state after application of pressure ceases. Whenapplication of pressure ceases, actuator 200, button 106 andinterference element 216 may return to original position as depicted inFIG. 2A.

Although particular examples of switch assembly 210 elements areprovided, those with skill in the art will recognize that any number ofswitch designs are available with switch elements at least partiallyenclosed by actuator 200 and button 106 with sonic weld joints betweenweld plate 202 and button 106 to provide a seal for the switch. Forexample, switch assembly 210 may have a first circuit board 222 mountedto inner surface 217 of actuator 200 having a first contact area 220positioned under a second contact area 224 coupled to a second circuitboard mounted to an inner surface 219 of button 106. First contact area220 may be positioned beneath second contact area 224 so that at leastone circuit may close when first contact area 220 and second contactarea 224 are put in physical contact and/or when movement of contactarea 224 closer towards terminal 221 (e.g., underneath contact area 220)causes a change in state that triggers closing the switch. For example,a second circuit board may be positioned such that contact areas of thefirst circuit board 222 are aligned with contact areas of the secondcircuit board.

Continuing with the example, second circuit board may be free-standingand/or mounted to one or more surfaces below. Second circuit board mayhave contact area 224, such as one or more conductive contact pads, thatcan form an electrical connection when put in contact with thecorresponding contact areas 220 of first circuit board 222 (e.g.,conductive contact pads 220 of first circuit board 222).

FIG. 3A is a cross sectional view of an alternative embodiment of switchassembly 110, similar to FIG. 2A, with sonic weld joints (denoted as205) taken across line II-II of FIG. 1A in accordance with someembodiments of the invention. Switch assembly 205 may have a weld plate202 coupled to an inner housing 201 of a button at one or more sonicweld joints (e.g., as depicted with 206 and 208) to form a seal aroundswitch assembly 205 elements (e.g., circuit boards and contact areas,etc.). At each sonic weld joint, a portion of a bottom surface (e.g., asdepicted with 209) of weld plate 202 and a portion of top surface (e.g.,as depicted with 211) of inner housing 201 may be welded together atsonic weld joints 206 and 208. Welding at sonic weld joints 206 and 208may cause the materials to melt at the welding area and form a hermeticseal and/or liquid resistant seal around actuator 200 and switchassembly 205 elements. The seal may protect switch assembly 205 elementsfrom corrosive elements. For example, weld plate 202 and inner housing201 may at least partially enclose a lip 214 of actuator 200 to ensurethat corrosive elements are not able to ingress actuator 200 to reachelements 220 and 224.

Weld plate 202 and inner housing 201 at sonic weld joints 206 and 208may be created out of plastic, metal, any other material, or combinationof materials that allows for sonic welding. Although FIG. 3A illustratesa particular joint design, those with skill in the art will recognizethat any other sonic weld joint design or configuration can be used formating surfaces (e.g., bottom surface 209 of weld plate 202 and uppersurface 211 of inner housing 201) for sonic welding. Any number of sonicweld joints 206 and 208 may be positioned around actuator 200 and switchassembly 205 elements.

Sonic weld joints 206 and 208 may be disposed around switch assembly 205elements to create a seal for the switch. In some embodiments, actuator200 (e.g., a dome shaped actuator) may be secured in place betweenwelded weld plate 202 and inner housing 201. Actuator 200 may have athree dimensional shape that at least partially encloses switch assembly205 elements. For example, actuator 200 may be a dome-shaped actuator200 to enclose a circuit board and/or contact areas 220 and 224.Actuator 200 may be formed from metal, plastic, and/or any otherflexible material that allows actuator 200 to deform and resists ingressof corrosive elements. By providing a seal around actuator 200, switchassembly 205 elements may be protected from corrosive elements.

When force is exerted on actuator 200, actuator 200 may deform allowingfirst contact area 220 and second contact areas 224 of switch assembly205 to move closer together. Further deformation of actuator 200, insome embodiments, may allow opposing electrical contact areas (e.g.,first contact areas 220 and second contact areas 224) within switchassembly 210 to come into physical contact and electrically connect toclose a circuit. In addition to or instead of closing a circuit withphysical contact between opposing contact areas, force exerted onactuator 200 may allow second contact area 224 and terminal 221 to movecloser together to cause a change in state, such as an increase incapacitance, and detection of the change in state may trigger closing acircuit.

A capacitor may be defined between contact area 224 and terminal 221(e.g., beneath contact area 220). For example, terminal 221 may bepositioned on the surface of circuit board 222 or within a stack oflayer that create circuit board 222 and contact area 224 may bepositioned opposite terminal 221. In some embodiments, terminal 221 canbe electrically connected to controller 223 operative to detect and/ormeasure a change in electrical attributes associated with terminal 221when button 106 is depressed and/or released, and the detection of whichmay trigger closing or opening a circuit in response to the detectedand/or measured change.

At rest in an original state, electrical contact areas 220 and 224 ofswitch assembly 205 are separated and the switch is said to beelectrically “open.” In some embodiments, when actuator 200 iscompressed to a point where actuator 200 deforms, opposing electricalcontact areas 220 and 224 of the switch may be moved to be in physicaland electrical contact to complete an electrical circuit betweenopposing contact areas 220 and 224, and are said to electrically “close”the switch. The switch may also or instead be triggered by movement ofsecond contact area 224 and terminal 221 (e.g., beneath first contactarea 220) closer together to change a state (e.g., capacitance) anddetection of the change by the controller 223 may cause the controller223 to close the circuit. And, when second contact area 224 and terminal221 (e.g., beneath first contact area 220) move further apart, thecontroller 223 detects that change in capacitance as well and opens thecircuit.

Actuator 200 may compress when contact force is exerted on actuator 200from above. Force may be applied to button 106 on surface 107 by a userfrom above in a direction of arrow A causing actuator 200 to deform. Forexample, a user may apply force on actuator 200 by depressing button 106within housing 101. FIG. 3B below provides more detail on a deformedactuator 200 that may create an electrical connection between contactareas 220 and 224.

A portion 214 (e.g., a lip) of actuator 200 may fit within gap 212 or acavity provided between weld plate 202 and inner housing 201 to secureactuator 200 in place. In some embodiments, the portion 214 of actuator200 may be a lip that fits within gap 212, and actuator 200 may movetowards or away from interference element 216 when a user interacts withbutton 106. The portion 214 of actuator 200 may be a lip and/or an edgeof actuator 200 that can fit within gap 212 and is positioned belowinterference element 216. Interference element 216 provides interferencewhen actuator 200 deforms or moves within gap 212, and interferenceelement 216 may act as an additional seal for switch assembly 205.

In one or more embodiments, as shown in FIG. 3A, interference element216 may be an O-ring. Interference element 216 may be sized and have aparticular shape to provide a substantially guaranteed interference fitfor actuator 200.

One or more electrical contact areas (e.g., 220 and 224), such as coppercoated conductive pads, may be coupled to a circuit board (e.g., circuitboard 222) at fit underneath actuator 200. Circuit boards can haveconductive silicon glued to the board and/or have silicon with traces.Circuit boards (e.g., circuit board 222) can extend away from switchassembly 205 and can support and interconnect with any desired amountsof circuitry (e.g., controller 223) for device 100.

For example, a circuit board may fit underneath actuator 200 and haveelectrical contact area 224, such as one or more conductive pads thatare coupled to the circuit board. Contact area 224 may electricallyconnect when put in contact with another opposing electrical contactarea (e.g., contact area 220) and/or when movement of and second contactarea 224 towards terminal 221 causes a change in state detected by thecontroller and the controller closes the switch. In an embodiment,conductive contact pads of contact area 224 are copper coated conductivepads, and contact area 220 is a conductive material either applied tocircuit board 222.

FIG. 3B is a cross sectional view of switch assembly 110, similar toFIG. 2B, with sonic weld joints (denoted as 205) taken across line II-IIof FIG. 1A in accordance with some embodiments of the invention. FIG. 3Billustrates an actuator 200 of switch assembly 205 in an actuated state.When actuator 200 is in the actuated state, actuator 200 is deformedcausing contact areas 220 and 224 to move closer together. Force appliedto top surface 107 of button 106 in the direction of arrow A may causeactuator 200 to decompress. Movement of contact area 224 and terminal221 closer together may cause a change in state (e.g., increasecapacitance) and the detected change in state may be detected bycontroller 223 and the controller 223 may close the switch in someembodiments. Enough force may be applied to top surface 107 of button106 and, in turn, to actuator 200 resulting in deformation of actuator200 and allowing contact areas 220 and 224 to be put in sufficientphysical contact, and the switch may close.

In an embodiment, pressure may be applied to top surface 107 of button106 and actuator 200 may move toward inner housing 201 thereby causinglip 214 to compress against interference element 216. Interferenceelement 216 may be designed to handle the application of pressure. Forexample, interference element 216 may deform and/or absorb some of thepressure when force is applied. When application of pressure ceases,actuator 200, button 106 and interference element 216 may return tooriginal position as depicted in FIG. 3A.

Although particular examples of switch assembly 205 elements areprovided, those with skill in the art will recognize that any number ofswitch designs are available to at least partially enclose switchelements with an actuator and an inner housing 201 and to provide a sealaround switch elements and the actuator by securing a portion of theactuator between a welded weld plate 204 and inner housing 201. Forexample, switch assembly 205 may have a second circuit board mounted toinner surface 217 of actuator 200 having a second contact area 224positioned over a first contact area 220 coupled to first circuit board222 mounted to an inner surface 219 of inner housing 201. First contactarea 220 may be positioned below second contact area 224 so that atleast one circuit may close when first contact area 220 and secondcontact area 224 are put in physical contact. For example, a secondcircuit board may be positioned such that contact areas of the firstcircuit board 222 are aligned with contact areas of the second circuitboard.

Continuing with the example, first circuit board may be free-standingand/or mounted to one or more surfaces below. First circuit board 222may have contact area 220, such as one or more conductive contact pads,that can form an electrical connection when put in contact with thecorresponding contact areas 224 of second circuit board.

FIG. 4 is a bottom perspective view of elements of switch assembly withsonic weld joints (denoted as 210) in accordance with some embodimentsof the invention. Weld plate 202 may have disc shape sized to fit overinterference element 216 and around dome actuator 200. Weld plate 202may be welded to button 106 at sonic weld joints to create a seal aroundactuator 200. Portion 214 of actuator 200 may fit between weld plate 202and button 106. Interference element 216 may fit between weld plate 202and actuator 200. In some embodiments, when actuator 200 is actuated,contact areas within actuator 200 may move physically closer to change astate and/or come in to physical contact to allow for the contact areasto electrically connect and close at least one circuit on circuit board222.

FIG. 5 is a bottom perspective view of switch assembly with sonic weldjoints (denoted as 210) in accordance with some embodiments of theinvention. Switch assembly 210 is shown with weld plate 202 welded atsonic weld joints to button 106, and sonic weld joints are disposedaround actuator 200 to provide a hermetic seal. A portion of dome-shapedactuator 200 is exposed and may be actuated with an application of forceon button 106 to close at least one circuit on circuit board 222.

FIG. 6 is a bottom cross sectional view of switch assembly 110 withsonic weld joints (denoted as 210) taken across line VI-VI of FIG. 1A inaccordance with some embodiments of the invention. Weld plate 202 iswelded to button 106 at sonic weld joints 206 and 208 to protect switchelements of switch assembly 210 from corrosive elements.

FIG. 7 is a flowchart illustrating a method in accordance with someembodiments of the invention. Flowchart 700 illustrates a method forcreating a seal around switch elements. An actuator 200 of a switch maybe positioned underneath a button 106 to at least partially enclose atleast one switch element (702). A portion 214 of the actuator 200 may besecured between an underside surface of the button and a weld plate 202(704). The portion of the actuator 200 may be a lip 214 that fitsbetween the button 106 and the weld plate 202. A contact area may becoupled to a first circuit board for the switch and mounted to a surfaceof the actuator 200. The weld plate 202 may be welded to the undersidesurface of the button 106 with at least one sonic weld joint 206 and 208to create a seal around the actuator 200 and the at least one switchelement (706). The sonic weld joints 206 and 208 may be disposed aroundthe actuator 200 to ensure that the switch elements are protected fromcorrosive elements.

FIG. 8 is a cross sectional view of switch assembly 110 using conductivecovering (denoted as 310) taken across line II-II of FIG. 1A inaccordance with some embodiments of the invention. Conductive covering300 encloses elements of switch assembly 310 to ensure protection fromliquids and/or other corrosive elements. Conductive covering 300 may becreated from conductive silicon or any other conductive material thatprotects switch assembly 310 elements.

Conductive covering 300 may be shaped to house one or more circuitboards (e.g., circuit board 302) for switch assembly 310. In anembodiment, conductive covering 300 may be shaped like a boot to enclosea similarly shaped circuit board 302. Conductive covering 300 may haveany three dimensional shape that allows for enclosing switch assembly310 elements and provides room for movement of inner surface 314 ofconductive covering 300 toward switch elements. In particular, threedimensional shaped conductive covering 300 may have a shape that allowsfor switch to be open at rest, and conductive covering 300 may provideenough room for inner surface 314 to move closer to contact area 312 andclose the switch when sufficient force is applied at top surface 316 ofconductive covering 300.

In some embodiments, conductive covering 300 may be compressed to comeinto physical and electrical contact with contact areas (e.g., contactarea 312) on circuit boards (e.g., circuit board 302) housed within. Inan embodiment, actuator 306 is a metal dome that may be positioned overconductive covering 300. When force is applied to top surface 107 ofbutton 106 in the direction of arrow A, actuator 306 may deform and comeinto contact with conductive covering 300. Force exerted on conductivecovering 300 may allow conductive covering 300 to move closer to contactarea 312 of at least one circuit board 302 within switch assembly 310 toclose the switch.

In addition or instead of closing a switch with physical contact betweenconductive covering 300 and contact areas, compression of actuator 306and/or conductive covering 300 may change a state (e.g., capacitance)that may be detected by controller 305 and controller 305 may causecompletion of a circuit. A capacitor may be defined between conductivecovering 300 and terminal 303 on circuit board 302. For example,terminal 303 may be positioned on the surface of circuit board 302 orwithin a stack of layer that create circuit board 302 and conductivecovering 300 may be positioned opposite terminal 303. In someembodiments, terminal 303 can be electrically connected to controller305 operative to detect and/or measure a change in electrical attributesassociated with terminal 303 when button 106 is depressed and/orreleased, and the detection of which may trigger closing or opening acircuit in response to the detected and/or measured change. For example,conductive covering 300 and terminal 303 on circuit board 302 may beconductors of a capacitor, and movement of conductive covering 300 mayincrease the capacitance that may be detected by controller 305 andcause the controller to close a circuit.

In an embodiment, switch assembly 310 may have a switch with contactareas (e.g., conductive contact pad 312) that surround a circuit board302 (e.g., located above and below the circuit board) or are coupled toone side of a circuit board 302 (e.g., contact areas 312 above thecircuit board 302). A contact area of switch assembly 310 may be coupledto bottom inner surface 318 of conductive covering 300. When forceexerted on conductive covering 300 brings conductive covering 300 incontact with contact area 312, at least one circuit for switch 310 maybe closed. The switch 310 may also or instead be triggered by movementof conductive covering 300 and terminal 303 closer together to changestate (e.g., capacitance) and detection of the change by the controller305 may cause completion of the circuit. And, when conductive covering300 and terminal 303 move further apart, the controller 305 detects thechange in capacitance as well and opens the circuit.

As depicted, in some embodiments, conductive covering 300 may be tuckedup into button 106. For example, conductive covering 300 may fit withina cavity or hollow section of button 106.

FIG. 9 is a cross sectional view of switch assembly 110 using conductivecovering (denoted as 310) taken across line II-II of FIG. 1A inaccordance with some embodiments of the invention. When force is exertedon top surface 107 of button 106 in direction of arrow A, actuator 306may deform as illustrated in FIG. 9. In some embodiments, application orremoval of force on button 106, actuator 306, and/or conductive covering300 may cause a change of state (e.g., capacitance) and detection of thechange in state by controller 305 may cause the controller 305 to closeor open the switch. If sufficient force is applied to actuator 306, thenconductive covering 300 located beneath actuator 306 may, in turn,deform to allow inner surface 314 of conductive covering 300 tophysically come into contact with contact area 312 of switch and closethe switch in some embodiments.

When application of pressure ceases, actuator 306 and conductivecovering 300 may return to original position as depicted in FIG. 8.

FIG. 10 is a bottom cross sectional view of switch assembly 110 usingconductive covering (denoted as 310) taken across line VI-VI of FIG. 1Ain accordance with some embodiments of the invention. Conductivecovering 300 may completely enclose switch elements of switch assembly310. Conductive covering 300 may be created from flexible conductivesilicon that can bend enough to allow for easy removal of tools used toput conductive covering 300 in places within the device 100. In anotherembodiment, conductive covering 300 may partially cover switch elements.For example, conductive covering 300 may provide a covering for onlyswitch elements at risk to exposure to corrosive elements, such asconductive contact areas, and other portions of a flexible circuit mayremain exposed. The conductive covering 300 may be formed from anymaterial that protects switch assembly 310 elements from corrosiveelements.

FIG. 11 is a bottom perspective view of switch assembly with conductivecovering (denoted as 310) in accordance with some embodiments of theinvention. Conductive covering 300 fits over circuit board 302 toenclose and protect switch from corrosive elements. Conductive covering300 may fit within button 106 and actuator 306 may be coupled to button106 or conductive covering 300 so as to fit over conductive covering300. Dome sheet 301 may fit over actuator 306 (e.g., metal dome) to fixactuator 306 in place. Dome sheet 301 may be formed from plastic, rubberor any other flexible material. Adhesive may be applied to button 106 oractuator 306 to secure dome sheet 301 over actuator 306 and keepconductive covering 300 in place.

FIG. 12 is a bottom perspective view of switch assembly with conductivecovering (denoted as 310) in accordance with some embodiments of theinvention. Circuit board 302 fits within conductive covering 300 thatsits within a cavity of button 106. Dome sheet 301 is shown coupled tobutton 106 to secure actuator 306 over conductive covering 300.

FIG. 13 is a flowchart illustrating a method in accordance with someembodiments of the invention. Flowchart 1300 illustrates a method forenclosing a switch in a conductive covering for a device. A contact areamay be coupled to a circuit board for a switch (1302). The circuit boardmay be enclosed in a conductive covering (1304). In some embodiments,the conductive covering is made from a flexible material that can easilybend to allow for placement within device 100. An actuator may fit overthe conductive covering such that depression of the actuator causescompression of the conductive covering (1306). The actuator may be ametal dome that is secured over conductive covering with the use of adome sheet.

FIG. 14 is a cross sectional view of switch assembly using conductiveadhesive (denoted as 410) taken across line II-II of FIG. 1A inaccordance with some embodiments of the invention. Button 106 may befitted within housing to sit over second circuit board 408. In anembodiment, button 106 may serve as an actuator for switch assembly 410.When pressure is applied to button 106 in the direction of arrow A,button 106 may compress second circuit board 408 to move closer to firstcircuit board 402 to close the switch 412.

Switch assembly 410 may have electrical contact areas 404 and 406, suchas conductive contact pads 404 coupled to first circuit board 402 andconductive contact pads 406 coupled to second circuit board 408. In anembodiment, conductive contact pads 404 and 406 may be at leastpartially ring-shaped. Although conductive contact pads are depicted asring-shaped, those with skill in the art will recognize that othershapes for contact pads may be used to create a seal around switchelements.

A layer of conductive adhesive 416 may be applied to at least a portionof conductive contact pad 404 and a portion of conductive contact pad406 of second circuit board 408. For example, if conductive contact pads404 and 406 are partially ring-shaped, a ring-shaped layer of conductiveadhesive 416 may sit between conductive contact pad 404 and conductivecontact pad 406. Layers of conductive adhesive 416 may form a waterresistant seal for the switch elements of switch assembly 410. Althoughapplication of conductive adhesive is described as being applied to takethe shape of the conductive pad (e.g., a ring-shaped conductive pad),those with skill in the art will recognize that a conductive adhesivemay be applied to take any shape and/or in any manner to form a seal.

FIG. 15 is a cross sectional view of switch assembly using conductiveadhesive (denoted as 410) taken across line II-II of FIG. 1A inaccordance with some embodiments of the invention. Force may be exertedon switch 412 at top surface 107 in direction of arrow A to compressbutton 106. The compression of button 106 may compress the secondcircuit board 408 positioned under the button 106. When second circuitboard 408 is compressed into first circuit board 402, contact areas 406and 404 may come into physical contact and electrically connect andcomplete at least one circuit of switch 412.

In addition to or instead of completing a circuit by physical contact,opposing contact areas (e.g., 406 and 408) and/or other opposing switch412 elements may serve as conductors of a capacitor and contact withbutton 106, movement of button 106, and/or circuit board 408 may changea state (e.g., increase capacitance). In particular, a capacitor may bedefined between contact area 413 and terminal 403 (e.g., beneath contactarea 415).

For example, terminal 403 may be positioned on the surface of circuitboard 402 or within a stack of layers that create circuit board 402 andcontact area 413 may be positioned opposite terminal 403. In someembodiments, terminal 403 can be electrically connected to controller405 and controller 405 may be operative to detect and/or measure achange in electrical attributes associated with terminal 403 when button106 is depressed to close a circuit and/or released to open a circuit,and the detection of which may trigger closing or opening a circuit inresponse to the detected and/or measured change. Controller 405 maydetect the change in state and cause the completion of at least onecircuit of switch 412 and/or open a circuit of switch 412.

In some embodiments, second and first circuit boards 408 and 402 mayhave inner conductive contact pads 413 and 415, respectively. Whensecond circuit board 408 is compressed into first circuit board 402,inner conductive pads 413 and 415 may be put into physical contact so asto electrically connect and close at least one circuit of switch 412. Asshown, inner conductive pads 413 and 415 are not coupled together with aconductive adhesive, and as a result, relatively more force may beapplied to the actuator to cause inner conductive pads 413 and 415 tocome in to physical contact and close a circuit than an amount of forceapplied to cause contact pads 404 and 406 to close a circuit.

When application of pressure ceases, button 106 and circuit board 408may return to original position as depicted in FIG. 14.

FIG. 16 is a bottom perspective view of an assembly process for a switchassembly using conductive adhesive. At step 1600, first circuit board402 may have contact areas coupled to the first circuit board 402, suchas ring-shaped outer contact pad 404 and a circular inner contact pad415. Sheet 418 may secured to first circuit board 402, such as sheet 418may be soldered to first circuit board 402 (1602). Sheet 418 may becreated from metal (e.g., copper) or any other flexible material.Conductive adhesive may be applied over outer contact pad 404 and sheet418 (1604). For example, conductive adhesive may be applied to have athickness of 0.1 mm over contact pad 404 and the area of sheet solderedto first circuit board 402. Sheet 418 may be coupled (e.g., soldered) toinner contact pad 402 of second circuit board 408 (1606). Sheet 418 maybe folded over and second circuit board 408 may be pressed into firstcircuit board 402 (1608).

FIG. 17 is a cross sectional view of switch assembly using conductiveadhesive (denoted as 510) taken across line II-II of FIG. 1A inaccordance with some embodiments of the invention. First circuit board502 may have an outer contact pad 504 and inner contact pad 514. Contactsheet 518 may be coupled to first circuit board 502 and folded overfirst circuit board 502. Actuator 506 (e.g., dome) may be fitted overcontact sheet 518 and secured in place with dome sheet 508. A conductiveadhesive 516 may be applied between first circuit board 502 and contactsheet 518, and conductive adhesive 516 may provide a seal to protectswitch assembly 510 elements against corrosive elements.

FIG. 18 is a cross sectional view of switch assembly using conductiveadhesive (denoted as 510) taken across line II-II of FIG. 1A inaccordance with some embodiments of the invention. Force may be exertedon switch 512 at top surface 107 in direction of arrow A to compressbutton 106. The compression of button 106 may cause compression ofactuator 506 and contact sheet 518 positioned under the button 106. Whencontact sheet 518 is compressed into first circuit board 502, contactareas 514 and 504 may come into physical contact with contact sheet 518and electrically connect and complete at least one circuit of switch512.

In addition to or instead of completing a circuit by physical contact,opposing contact areas (e.g., 518 and 504) and/or other opposing switch512 elements may serve as conductors of a capacitor and contact withbutton 106, movement of button 106, and/or circuit board 518 may changea state (e.g., increase capacitance). In particular, a capacitor may bedefined between contact sheet 508 and terminal 501 (e.g., beneathcontact area 514). For example, terminal 501 may be positioned on thesurface of circuit board 502 or within a stack of layers that createcircuit board 502 and contact sheet 508 may be positioned oppositeterminal 501. In some embodiments, terminal 501 can be electricallyconnected to controller 503 and controller 503 may be operative todetect and/or measure a change in electrical attributes associated withterminal 501 when button 106 is depressed to close a circuit or open acircuit when button 106 is released. Controller 503 may detect thechange in state and cause the completion of at least one circuit ofswitch 512 and/or open a circuit of switch 512.

In some embodiments, first circuit board 502 may have inner conductivecontact pads 514. When contact sheet 518 is compressed into firstcircuit board 502, inner conductive pads 514 may be put into physicalcontact with contact sheet 518 so as to electrically connect and/ormoved closer together to change a state and close at least one circuitof switch 512. As shown, inner conductive pad 514 and contact sheet 518are not coupled together with a conductive adhesive, and as a result,relatively more force may be applied to actuator 506 to cause innerconductive pad 514 to come in to physical contact with contact sheet 518and closed a circuit than an amount of force applied to cause contactpad 504 and contact sheet 518 to close a circuit.

When application of pressure ceases, button 106 and circuit board 408may return to original position as depicted in FIG. 14.

FIG. 19 is a bottom perspective view of an assembly process for a switchassembly using conductive adhesive. At step 1900, first circuit board502 may have contact areas coupled to the first circuit board 502, suchas ring-shaped outer contact pad 504 and a circular inner contact pad514. Contact sheet 518 may be secured to first circuit board 502; suchas contact sheet 518 may be soldered to first circuit board 502 (1902).Contact sheet 518 may be created from a conductive metal (e.g., copper)or any other flexible, conductive material. Conductive adhesive 516 maybe applied over outer contact pad 504 and contact sheet 518 (1904). Forexample, conductive adhesive may be applied to have a thickness of 0.1mm over contact pad 504 and the area of contact sheet 518 soldered tofirst circuit board 502. Contact sheet 518 may be folded over andpressed into first circuit board 502 (1906). Actuator 506 and dome sheet508 may be secured over contact sheet 518 (1908).

FIG. 20 is a bottom perspective view of switch assembly with conductiveadhesive (denoted as 410) in accordance with some embodiments of theinvention. First circuit board 402 fits within button 106. Conductiveadhesive 416 is applied over first circuit board 402 to form a seal toprotect switch assembly 410 elements from corrosive elements. Secondcircuit board 408 may be pressed into conductive adhesive 416. Domesheet 401 may fit over second circuit board 408 to secure switchelements in place. Dome sheet 401 may be formed from plastic, rubber orany other flexible material. Adhesive may be applied to button 106 tosecure dome sheet 401 over switch elements to keep switch elements inplace.

FIG. 21 is a bottom perspective view of switch assembly with conductiveadhesive (denoted as 410) in accordance with some embodiments of theinvention. First circuit board 402 fits within button 106. Dome sheet401 is shown coupled to button 106 to fix switch elements in place, andconductive adhesive 416 is applied between second circuit board 408 andfirst circuit board 402 to form a seal to protect switch 412 elements.

FIG. 22 is a flowchart illustrating a method in accordance with someembodiments of the invention. A first conductive contact pad is coupledto a first board (2202). A second conductive contact pad is coupled to asecond board (2204). A layer is applied of conductive adhesive to atleast a portion of the first conductive pad (2206). The layer issituated between the first conductive pad and the second conductive pad,and the conductive adhesive provides a seal for a switch.

In certain embodiments, electronic device 100 can also include at leastone user input component that may be of a variety of forms other thanthat of a switch assembly. For example, device 100 can also include oneor more input components that may take other various forms, including,but not limited to switches, sliding switches, keypads, dials, scrollwheels, touch screen displays, electronics for accepting audio and/orvisual information, antennas, infrared ports, or combinations thereof.

According to certain embodiments, the position of one or more of inputcomponents can be widely varied relative to the position of another oneor more of input components. For example, they can be adjacent to oneanother or spaced apart. Additionally, each one of the one or more inputcomponents can be placed at any external surface (e.g., top, bottom,side, front, back, or edge) of housing 101 that may be accessible to auser during manipulation of the electronic device 100.

In certain embodiments, each of the one or more input components ofdevice 100 can be configured to provide one or more dedicated controlfunctions for making selections or issuing commands associated withoperating device 100. By way of example, in the case of a media player,an input component can be associated with powering up or down thedevice, opening or closing a menu, playing or stopping a song, changinga mode, and/or the like.

As mentioned above, certain embodiments of device 100 can include atleast one output component that provides the user with information,sound, and/or a display of information. Output components can takevarious forms including, but not limited to, audio speakers, headphones,audio line-outs, visual display, antennas, infrared ports, ports, or anycombination thereof.

In certain embodiments, one or more of the switch assemblies describedcan be integrated with another input component, including but notlimited to, the following: switches, push-button, keys, dials,trackball, joysticks, touch pads, touch screens, scroll wheels,displays, microphones, speakers, cameras, and/or the like.

Although not shown, device 100 may have many other elements in additionto input and output components, including, but not limited to: aprocessor, a storage device, communications circuitry, a bus and/or apower supply. The bus can provide a data transfer path for transferringdata to/from elements of device 100. The processor can control functionsof the device and other circuitry. For example, processor can receiveuser inputs from switch assembly 110 and drive output component 104.

Storage device can include one or more storage mediums, including, forexample, a hard drive, a permanent memory, such as ROM, a semi-permanentmemory, such as RAM, and/or a cache that can store data. Data caninclude, but is not limited to, the following: media, software,configuration information, and/or any other type of data.

Communications circuitry can include circuitry for wirelesscommunication (e.g. short and long range communication). For example,the wireless communication circuitry of device 100 can be Wi-Fi enablingcircuitry that permits wireless communication according to one of the802.11 standards. Other standards can be supported, such as Bluetooth®.Communication circuitry can include circuitry that enables device 100 tobe coupled to another device and communication with that other device.Additional electrical components can be provided for sending andreceiving media, including, but not limited to, microphones, amplifiers,digital signal processors, image sensors, optics, antennas, receivers,transmitters, transceivers, and the like.

While there have been described switches and methods for the producingswitches thereof, it is to be understood that many changes may be madetherein without departing from the spirit and scope of the invention.Insubstantial changes from the claimed subject matter as viewed by aperson with ordinary skill in the art, no known or later devised, areexpressly contemplated as being equivalently within the scope of theclaims. Therefore, obvious substitutions now or later known to one withordinary skill in the art are defined to be within the scope of thedefined elements. The described embodiments of the invention arepresented for the purpose of illustration and not of limitation.

What is claimed is:
 1. An input component assembly comprising: a firstconductive contact pad coupled to a first board of a switch; a secondconductive contact pad coupled to a second board of the switch; and alayer of conductive adhesive between the first conductive pad and thesecond conductive pad, wherein the layer is operative to provide a sealfor the switch.
 2. The input component assembly of claim 1, wherein thefirst and the second conductive contact pads are at least partially ringshaped and the layer is a ring of conductive adhesive between the firstand the second conductive contact pads.
 3. The input component assemblyof claim 1, wherein the first and the second conductive contact pads arecopper coated.
 4. The input component assembly of claim 1, wherein thefirst and the second boards are flexible printed circuit boards.
 5. Theinput component assembly of claim 1, wherein the layer preventscorrosive elements from coming in to contact with the switch.
 6. Theinput component assembly of claim 1, further comprising: a thirdconductive contact pad on the first board and a fourth conductivecontact pad on the second board; and a metal dome disposed over thesecond board, wherein the metal dome is operative to close at least onecircuit of the switch when the metal dome is depressed towards thesecond board.
 7. The input component assembly of claim 1, wherein theseal is water resistant.
 8. The input component assembly of claim 1,wherein the first board comprises conductive silicon glued to the firstboard.
 9. The input component assembly of claim 6, wherein the fourthconductive pad is a conductor of a capacitor, and the input componentassembly further comprising: a terminal positioned opposite the fourthconductive pad and operative to serve as another conductor of thecapacitor; and a controller operative to measure a change in capacitanceof the capacitor and close at least one circuit in response to themeasured change.
 10. A method of forming a switch assembly comprising:coupling a first conductive contact pad to a first board; coupling asecond conductive contact pad to a second board; and applying a layer ofconductive adhesive to at least a portion of the first conductive pad,wherein the layer is situated between the first conductive pad and thesecond conductive pad and the conductive adhesive provides a seal for aswitch.
 11. The method of forming a switch assembly of claim 10, furthercomprising: a controller electrically coupled to a terminal in the firstboard, and wherein the controller is operative to measure a change in acapacitance value and close at least one circuit in response to themeasured change.
 12. An electronic device comprising: a housingcomprising an opening therethrough; a button positioned in the opening,wherein the button is disposed over a dome of a switch; a firstconductive contact pad coupled to a first board of the switch; a secondconductive contact pad coupled to a second board of the switch, whereinthe dome is disposed over the second board and is operative to close atleast one circuit of the switch when depressed; and a layer ofconductive adhesive between the first conductive pad and the secondconductive pad, wherein the layer is operative to provide a seal for theswitch.
 13. The electronic device of claim 12, wherein the first and thesecond conductive contact pads are at least partially ring shaped andthe layer is a ring of conductive adhesive between the first and thesecond conductive contact pads.
 14. The electronic device of claim 12,wherein the first and second conductive contact pads are copper coated.15. The electronic device of claim 12, wherein the first and secondboards are flexible printed circuit boards.
 16. The electronic device ofclaim 12, wherein the layer prevents corrosive elements from coming into contact with the switch.
 17. The electronic device of claim 12,further comprising: a third conductive contact pad on the first boardand a fourth conductive contact pad on the second board, wherein thedome is operative to close the at least one circuit of the switch whenthe metal dome is depressed towards the second board.
 18. The electronicdevice of claim 12, wherein the seal is water resistant.
 19. Theelectronic device of claim 12, wherein the first board comprisesconductive silicon glued to the first board.
 20. The electronic deviceof claim 17, wherein the fourth conductive pad is a conductor of acapacitor, and the electronic device further comprising: a terminalpositioned opposite the fourth conductive pad and operative to serve asanother conductor of the capacitor; and a controller operative tomeasure a change in capacitance of the capacitor and close at least onecircuit in response to the measured change.